Basic Info.
Model NO.
XJY-PCB
Processing Technology
Electrolytic Foil
Base Material
Fr4
Insulation Materials
Organic Resin
Copper Thickness
1oz
Surface Finishing
Enig
Solder Mask Type
Green
Silkscreen
White
Board Thickness
1.6mm
Layer
1 to 18
Min. Hole Size
0.07mm
Min.Line Width
0.1mm
Min.Line Spacing
0.1mm
Finishing
Hal, OSP, Immersion
Transport Package
Vacuum Package
Specification
Normal
Trademark
XJYPCB
Origin
China
HS Code
8534009000
Production Capacity
8000square Meters Per Month
Product Description
-----------Welcome to our website! !
XinJiaye is able to offer one stop 1 to 24 Layer PCB fabrication, PCB manufacturing, component sourcing,PCB Assembly, PCBA Test, Reverse engineering service; FPC fabrication, Aluminium base fabrication,High Frequency Board fabrica-tion.
Our PCB board manufacture
* PCB board file with parts list provided by customers
* PCB board made, circuit board parts purchased by us
* Electronic testing circuit board
* Fast delivery, anti-static package
* RoHS Directive-compliant, lead-fre
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Quick Details
Place of Origin: | Shenzhen China (Mainland) | Brand Name: | XJY | Model Number: | xjy-pcb 322 |
Base Material: | FR-4 | Copper Thickness: | 1.0OZ | Board Thickness: | 1.6mm-3.2mm,0.2mm-4.5mm, |
Min. Hole Size: | 0.07--2.0 mm | Min. Line Width: | 0.1MM | Min. Line Spacing: | 0.1MM |
Surface Finishing: | Sensor PCB & PCBA With Immersion Gold | Base Material:: | FR-4 | Board Thickness:: | 1.6mm-3.2mm,0.2mm-4.5mm, |
Copper Thickness:: | 1.0OZ | Surface Finishing:: | Sensor PCB & PCBA With Immersion Gold | Cooper thickness:: | 0.5 OZ-11OZ (18 um-385 um) |
Board Type:: | Rigid, Flexible, Rigid-flexible | Finishing; | HAL, OSP, IMMERSION | Min. Line Width:: | 0.1MM |
Min. Hole Size:: | 0.07--2.0 mm | Certificate Standard:: | UL, ROHS |
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Technology capability
Items | Single/Double-sided Board/Multilayer Board/FPC(1-24Layer) | ||
| Base Materials | FR-4(High TG 150°-170°),FR1,Aluminum,CEM-3,BT,94vo | ||
| Finish copper thickness | Outer 6 OZ,Inner 4 OZ | ||
| Surface finish | ENIG, ImAg, ImSn, OSP, HASL,Plating gold | ||
| Finished Board Size | Max Double-sided Board | 640mm χ 1100mm | |
| Max Multilayer Board | 640mm χ 1100mm | ||
| Finished Board Hole Size (PTH Hole) | Min Finished Board Hole Size | 0.15mm | |
| Conductor Width and Spacing | Min Conductor Width | 0.01mm | |
| Min Conductor Spacing | 0.01mm | ||
| Thickness of Plating and Coating Layer | PTH Wall Copper Thickness | >0.02mm | |
| Tin Solder Thickness ( Hot Air Leveling ) | >0.02mm | ||
| Nickl/Gold Thickness | For customer special need | ||
| Nickl Plating Layer | >2um | ||
| Gold Plating Layer | >0.3um | ||
| Bare Board Test | Single Side Test | Max Test Point | 20480 |
| Max Board Test Size | 400mm χ 300mm | ||
| Double Side Test | Max Test Point | 40960(General Use) | |
| 4096(Special Use) | |||
| Max Board Test Size | 406mm χ 325mm | ||
| 320mm χ 400mm | |||
| Min Test pitch of SMT | 0.5mm | ||
| Test Voltage | 10-250V | ||
| Mechanical Process | Chamfer | 20°, 30°, 45°, 60° | |
| Angle Tolerance | ± 5° | ||
| Deepness Tolerance | ± 0.20mm | ||
| V-Cut Angle | 20°, 30°, 45° | ||
| Board Thickness | 0.1-3.2mm | ||
| Residues Thickness | ± 0.025mm | ||
| Cell Paraposition Precision | ± 0.025mm | ||
| Tolerance of Out-shape Process | ± 0.1mm | ||
| Board Warp | Max Value | 0.7% | |
| Optical Plotting | Max Plotting Area | 66mm χ 558.8mm | |
| Precision | ± 0.01mm | ||
| Repetitive Precision | ± 0.005mm | ||
Testing Procedures For PCB Board
---We perform multiple quality assuring procedures before shipping out any PCB board. These include:
* Visual Inspection
* Flying probe
* Bed of nails
· * Impedance control
· * Solder-ability detection
* Digital metallograghic microscope
· *AOI (Automated Optical Inspection)
Detailed Terms for PCB Manufacturing
---Technical requirement for PCB assembly:
* Professional Surface-mounting and Through-hole soldering Technology
* Various sizes like 1206, 0805, 0603 components SMT technology
* ICT(In Circuit Test), FCT(Functional Circuit Test) technology.
* PCB Assembly With UL, CE, FCC, RoHS Approval
* Nitrogen gas reflow soldering technology for SMT.
* High Standard SMT&Solder Assembly Line
* High density interconnected board placement technology capacity.
Delivery Time for PCB board
1) PCB production time: Sample: 3-4 days / mass production: Within 7 days
2) Component purchase: 2 days if all components is available in our domestic market.
3) PCB Assembly: Samples: Whthin 2 days / mass production: Within 5 days
Quotation Requirement:
Following specifications are needed for quotation:
A) Base material:
B) Board thickness:
C) Copper thickness
D) Surface treatment:
E) color of solder mask and silkscreen:
F) Quantity
Shipping Method and Payment terms:
1. By DHL, UPS, FedEx, TNT using clients account.
2. We suggest you using our DHL, UPS, FedEx, TNT forwarder.
3. By EMS (Usually for Russia Clients), price is high.
4. By sea for mass quantity according to customer's requirement.
5. By customer's Forwarder
6. By Paypal, T/T, West Union, etc.
Other Service:
A) We have many special material as rogers, teflon, taconic, Fr-4 high tg, Ceramic in stock. Welcome to send us your inquiry.
B) We also provide sourcing components, PCB design, PCB copy, PCB drawing, PCB assembly and so on.
Have any need pls feel free to contact me!
